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30 October - 3 November 2022 // San Diego, California, USA

Hybrid: In-Person and Virtual Conference

The Premier Conference Devoted to Technical Innovations in Electronic Design Automation

Welcome

About ICCAD 2022

Jointly sponsored by ACM and IEEE, ICCAD is the premier forum to explore the new challenges, present leading-edge innovative solutions, and identify emerging technologies in the electronic design automation research areas. ICCAD covers the full range of CAD topics – from device and circuit-level up through system-level, as well as post-CMOS design. ICCAD has a long-standing tradition of producing a cutting-edge, innovative technical program for attendees. The 41st edition of the conference to be held in San Diego, California, USA from 30 October-3 November 2022 will be no different! As the worldwide COVID-19 pandemic situations continues to evolve, an online registration option will be available for presenters and participants who are unable to attend in person due to travel restrictions.

Mark Your Calendars

Important Dates

21 July, 2022
NOTIFICATION OF ACCEPTANCE
15 August, 2022
FINAL PAPER SUBMISSION DEADLINE

Paper Submission

Original technical submissions on, but not limited to, the following topics are invited:

1.1 System Design

  • System-level specification, modeling, simulation, design flows
  • System-level issues for 3D integration
  • System-level design case studies and applications
  • HW/SW co-design, co-simulation, co-optimization, and co-exploration, platforms for emulation and rapid prototyping
  • Micro-architectural transformation
  • Multi-/many-core processor, GPU and heterogeneous SoC
  • Memory and storage architecture and system synthesis
  • System communication architecture, Network-on-chip design
  • Modeling, simulation, high-level synthesis, power/performance analysis, programming of heterogeneous computing platforms
  • Application driven system design for big data
  • Analysis and optimization of data centers

1.2 Embedded, Cyber-Physical (CPS), IoT

  • Systems and Software
  • AI and machine learning for embedded systems
  • HW/SW co-design for embedded systems
  • Compute, memory, storage, interconnect for embedded systems
  • Domain-specific accelerators
  • Energy/power management and energy harvesting
  • Real-time software and systems
  • Middleware, virtual machines, and runtime support
  • Dependable, safe, secure, trustworthy embedded systems
  • Embedded software: compilation, optimization, testing
  • CAD for IoT, edge and fog computing
  • Modeling, analysis, verification of CPS systems
  • Green computing (smart grid, energy, solar panels, etc.)
  • CAD for application domains including wearables, health care, autonomous systems, smart cities

1.3 Neural Networks and Deep Learning

  • Hardware and architecture for neural networks
  • Compilers for deep neural networks
  • Design method for learning on a chip
  • System-level design for (deep) neural computing
  • Neural network acceleration including GPU and ASICs
  • Safe and secure machine learning
  • Hardware accelerators for Artificial Intelligence

1.4 Reconfigurable Computing

  • Novel reconfigurable architectures (FPGA, CGRA, etc.)
  • Neural network acceleration on reconfigurable accelerators
  • High-level synthesis on reconfigurable architectures
  • Compilers for reconfigurable architectures
  • Reconfigurable fabric security
  • HW/SW prototyping and emulation on FPGAs
  • Post-synthesis optimization for FPGAs
  • FPGA-based prototyping for analog, mixed-signal, RF systems

1.5 Hardware Security, Security Architecture
and Systems

  • Hardware Trojans, side-channel attacks, fault attacks and countermeasures
  • New physical attack vectors or methods for ASICs
  • Nano electronic security
  • Hardware-based security (CAD for PUF’s, RNG, AES etc.)
  • Split Manufacturing for security
  • Supply chain security and anti-counterfeiting
  • Artificial Intelligence for attack prevention systems
  • Design and CAD for security
  • Security implications of CAD
  • Trusted execution environments
  • Privacy-preserving computation
  • Cloud Computing data security
  • Sensor network security

1.6 Low Power and Approximate Computing in
System Design

  • Power and thermal estimation, analysis, optimization, and management techniques for hardware and software systems
  • Energy- and thermal-aware application mapping and scheduling
  • Energy- and thermal-aware architectures, algorithms
  • Energy- and thermal-aware dark silicon system design
  • Hardware techniques for approximate/stochastic computing

2.1 High-Level, Behavioral, and Logic Synthesis and Optimization

  • High-level/Behavioral/Logic synthesis
  • Technology-independent optimization and technology mapping
  • Functional and logic timing ECO (engineering change order)
  • Resource scheduling, allocation, and synthesis
  • Interaction between logic synthesis and physical design

2.2 Testing, Validation, Simulation, and Verification

  • High-level/Behavioral/Logic modeling, validation, simulation
  • Formal, semi-formal, and assertion-based verification
  • Equivalence and property checking
  • Emulation and hardware simulation/acceleration
  • Post-silicon validation and debug
  • Digital fault modeling and simulation
  • Delay, current-based, low-power test
  • ATPG, BIST, DFT, and compression
  • Memory test and repair
  • Core, board, system, and 3D IC test

2.3 Cell-Library Design, Partitioning, Floorplanning, Placement

  • Cell-library design and optimization
  • Transistor and gate sizing
  • High-level physical design and synthesis
  • Estimation and hierarchy management
  • 2D and 3D partitioning, floorplanning, and placement
  • Post-placement optimization
  • Buffer insertion and interconnect planning

2.4 Clock Network Synthesis, Routing, and Post-Layout Optimization and Verification

  • 2D and 3D clock network synthesis
  • 2D and 3D global and detailed routing
  • Package-/Board-level
  • Chip-package-board co-design
  • Post-layout/-silicon optimization
  • Layout and routing issues for optical interconnects

2.5 Design for Manufacturability and Design for Reliability

  • Process technology characterization, extraction, and modeling
  • CAD for design/manufacturing interfaces
  • CAD for reticle enhancement and lithography-related design
  • Variability analysis and statistical design and optimization
  • Yield estimation and design for yield
  • Physical verification and design rule checking
  • Machine learning for smart manufacturing and process control
  • Analysis and optimization for device-level reliability issues
  • Analysis optimization for interconnect reliability issues
  • Reliability issues related to soft errors
  • Design for resilience and robustness

2.6 Timing, Power and Signal Integrity Analysis and Optimization

  • Deterministic and statistical static timing analysis, optimization
  • Power and leakage analysis and optimization
  • Circuit and interconnect-level low power design issues
  • Power/ground network analysis and synthesis
  • Signal integrity analysis and optimization

2.7 CAD for Analog/Mixed-Signal/RF and Multi-Domain Modeling

  • Analog, mixed-signal, and RF noise modeling, simulation, test
  • Electromagnetic simulation and optimization
  • Device, interconnect and circuit extraction and simulation
  • Behavior modeling of devices and interconnect
  • Package modeling and analysis
  • Modeling of complex dynamical systems (molecular dynamics, fluid dynamics, computational finance, etc.)

3.1 Bio-inspired and Neuromorphic Computing, Biological Systems and Electronics, and New  Computing Paradigms

    • Network and neuron models
    • Devices and hardware for neuromorphic computing
    • Non-von Neumann architectures
    • PEvent or spike-based hardware systems
    • CAD for biological computing systems
    • CAD for synthetic biology
    • CAD for bio-electronic devices, bio-sensors, MEMS Systems


3.2 Nanoscale and Post-CMOS Systems

  •  New device structures and process technologies
  • New memory technologies (flash, PCM, STT-RAM, memristor)
  • Nanotechnologies, nanowires, nanotubes, graphene, etc.
  • Quantum computing
  • CAD for mixed-domain (semiconductor, nanoelectronic, MEMS, and electro-optical) devices, circuits, and systems
  • CAD for nanophotonics and optical devices/ communication
  • DFM and reliability issues for emerging devices (3D, Nanophotonics, non-volatile logic/memory, etc.)
  • Device, interconnect and circuit extraction and simulation
  • Behavior modeling of devices and interconnect
  • Package modeling and analysis
  • Modeling of complex dynamical systems (molecular dynamics, fluid dynamics, computational finance, etc.)

Proposal Submission

All ICCAD tutorials are embedded in the main technical program and free to conference attendees, providing value to attendees and a good audience for presenters. Typical tutorials run 1.5-2 hours, although longer tutorials (consisting of two session blocks of 1.5-2 hours each) may be considered. Tutorial suggestions should not exceed two pages, should describe the topic and intended audience, and must include a list of suggested participants with biographical data. Proposals should focus on the state-of-the-art in a specific area of broad interest amongst ICCAD attendees. All tutorial proposals should be submitted through the ICCAD submission website and questions can be addressed to Robert Wille, Tutorial and Special Sessions Chair, at [email protected]. Please read the proposal guidelines at ICCAD website.

Special Sessions typically run 1.5-2 hours. Special session proposals should focus on in-depth treatment on a topic of timely interest to the ICCAD audience. Special session proposals should not exceed two pages, should describe the topic and intended audience, and must include a list of suggested participants with biographical data. All special session proposals should be submitted through the ICCAD submission website and questions can be addressed to Robert Wille, Tutorial and Special Sessions Chair, at [email protected]. Please read the proposal guidelines at ICCAD website.

CCAD provides a vibrant and supportive environment for small-to-medium-sized affiliated workshops. Typical workshops are one-day events on the Thursday of ICCAD. All workshop proposals should be sent to Deming Chen, the Workshop Chair, at [email protected].

Panel suggestions should not exceed two pages, should describe the topic and intended audience, and should include a list of suggested participants. Panel suggestions must include a bulleted outline of covered topics. All panel proposals should be sent to Evangeline Young, Program Chair at [email protected].

Keynote proposals should include descriptions of suggested keynote speakers, and the importance of the speech to the ICCAD audience. All keynote proposals should be sent to Tulika Mitra, General Chair, at [email protected]. ICCAD reserves the right to restructure all panel, special session, and tutorial proposals.

On Location

San Diego, CA

Special Thanks

Conference Sponsors

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