MONDAY November 02, 8:00am - 8:30am | Slot 2
* Indicates Best Paper Candidate
EVENT TYPE: REGULAR SESSION
SESSION 1B
Electromigration and Circuit Yield: Efficient Verification Techniques
Moderator:
Ing-Chao Lin - National Cheng Kung Univ.
Continuing scaling of integrated circuits has made the active devices as well as interconnections even smaller, which greatly improved circuit performance, while device parameter variation and current density of wires increased significantly. The yield of the manufactured circuit and its long-term reliability have become a major concern in designing circuits. In this session, we discuss efficient electromigration immortality check methods considering current density fluctuation and Joule heating, and a fast Monte Carlo method that uses non-Gaussian adaptive importance sampling technique for accelerating the yield analyses.
| 1B.1* | Electromigration Checking Using a Stochastic Effective Current Model | |
| Speaker: | Adam Issa - Univ. of Toronto, Canada |
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| Authors: | Adam Issa - Univ. of Toronto, Canada Valeriy Sukharev - Mentor, A Siemens Business, Fremont, CA Farid N. Najm - Univ. of Toronto, Canada |
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| 1B.2 | Electromigration Immortality Check considering Joule Heating Effect for Multisegment Wires | |
| Speaker: | Mohammadamir Kavousi - Univ. of California, Riverside, CA |
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| Authors: | Mohammadamir Kavousi - Univ. of California, Riverside, CA Liang Chen - Univ. of California, Riverside, CA Sheldon X. Tan - Univ. of California, Riverside, CA |
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| 1B.3 | A Non-Gaussian Adaptive Importance Sampling Method for High-Dimensional and Multi-Failure-Region Yield Analysis | |
| Speaker: | Hao Yan - Southeast Univ., Nanjing, China |
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| Authors: | Xiao Shi - Univ. of California, Los Angeles, CA Hao Yan - Southeast Univ., Nanjing, China chuwen li - Southeast Univ., Nanjing, China Jianli Chen - Fudan Univ., Shanghai, China Longxing Shi - Southeast Univ., China Lei He - Univ. of California, Los Angeles & Fudan Univ., CA |
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* Indicates Best Paper Candidate