History

ICCAD archive is a historical reference for the CAD community. ICCAD does not provide slides within the archive for Workshop or Panel sessions. You may contact the speaker directly in order to obtain these presentation materials.

Published papers for ICCAD can be found on the IEEE Xplore site or ACM‘s website.

2019MIPAward
Award Recipients

Front-End Category Award

ICCAD_2021_Frontend

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BOOM-Explorer: RISC-V BOOM Microarchitecture Design Space Exploration Framework

Chen Bai, The Chinese University of Hong Kong, Qi Sun, The Chinese University of Hong Kong, Jianwang Zhai, Tsinghua University, Yuzhe Ma, The Chinese University of Hong Kong, Bei Yu, The Chinese University of Hong Kong, Martin Wong, The Chinese University of Hong Kong


 

Back-End Category Award

ICCAD_2021_Backend

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Analytical Modeling of Transient Electromigration Stress based on Boundary Reflections
Mohammad Abdullah Al Shohel, University of Minnesota, Vidya A. Chhabria, University of Minnesota, Nestor Evmorfopoulos, University of Thessaly, Sachin S. Sapatnekar, University of Minnesota


 

Ten Year Retrospective Most Influential Paper Award

ICCAD_2021_10Year

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MACACO: Modeling and Analysis of Circuits for Approximate Computing
Rangharajan Venkatesan, Amit Agarwal, Kaushik Roy, Anand Raghunathan (Purdue University)


 

Ernest S. Kuh Early Career Award

 

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Jeyavijayan Rajendran (Texas A&M University)


 

Ernest S. Kuh Early Career Award

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Zheng Zhang (University of California, Santa Barbara)

IEEE/ACM WILLIAM J. MCCALLA ICCAD BEST PAPER AWARD

This award is given in memory of William J. McCalla for his contributions to ICCAD and his CAD technical work throughout his career.

Front-End Award:Session 8C.1:
HyperFuzzing for SoC Security Validation

Sujit Kumar Muduli, Gourav Takhar and Pramod Subramanayan
Indian Institute of Technology Kanpur

Back End Award: Session 1B.1:
Electromigration Checking Using a Stochastic Effective Current Model

 

Adam Issa
University of Toronto
Valeriy Sukharev
Mentor, A Siemens Business
Farid N. Najm
University of Toronto
 
Ten Year Retrospective Most Influential Paper Award 
3D-ICE: Fast Compact Transient Thermal Modeling for 3D ICs with Inter-Tier Liquid Cooling, 2010
 
 
A. Sridhar, A. Vincenzi, M. Ruggiero,

T. Brunschwiler and D. Atienza

IEEE/ACM WILLIAM J. MCCALLA ICCAD BEST PAPER AWARD
This award is given in memory of William J. McCalla for his contributions to ICCAD and his CAD technical work throughout his career.
Front-End Award:Session 4B.1:
Analyzing and Modeling In-Storage Computing Workloads On EISC — An FPGA-Based System-Level Emulation Platform

Zhenyuan Ruan, Tong He, Jason Cong
Univ. of California, Los Angeles


Back End Award: Session 1B.1:
Power Grid Fixing for Electromigration-Induced Voltage Failures


Zahi Moudallal, Farid N. Najm
University of Toronto
Valeriy Sukharev
Mentor, A Siemens Business

Ten Year Retrospective Most Influential Paper Award 
Nonvolatile Memristor Memory: Device Characteristics and Design Implications, 2009

Yenpo Ho, Garng M. Huang, Peng Li
Texas A&M University
IEEE/ACM WILLIAM J. MCCALLA ICCAD BEST PAPER AWARD
This award is given in memory of William J. McCalla for his contributions to ICCAD and his CAD technical work throughout his career.
Front-End Award:Session 5C.1:
DNNBuilder: An Automated Tool for Building High-Performance DNN Hardware Accelerators for FPGAs

Xiaofan Zhang, Wen-Mei Hwu, Deming Chen
Univ. of Illinois at Urbana-Champaign
unsong Wang, Chao Zhu, Yonghua Lin, Jinjun Xiong
IBM Research


Back End Award: Session 10B.1:
PolyCleaner: Clean Your Polynomials Before Backward Rewriting to Verify Million-Gate Multiplier

Alireza Mahzoon, Daniel Große, Rolf Drechsler
Universität Bremen / DFKI

Ten Year Retrospective Most Influential Paper Award 
A Low-Overhead Fault Tolerance Scheme for TSV-Based 3D Network on Chip Links, 2008

Igor Loi, Luca Benini
Univ. of Bologna & EPFL
Subhasish Mitra, Thomas H. Lee
Stanford Univ.
Shinobu Fujita
Toshiba
IEEE/ACM WILLIAM J. MCCALLA ICCAD BEST PAPER AWARD
This award is given in memory of William J. McCalla for his contributions to ICCAD and his CAD technical work throughout his career.
Front-End Award:Session 6A.4:
COMBA: A Comprehensive Model-Based Analysis Framework for High Level Synthesis of Real Applications
Jieru Zhao, Liang Feng, Wei Zhang
Hong Kong Univ. of Science and Technology
Sharad Sinha
Nanyang Technological Univ.
Yun (Eric) Liang
Peking Univ.
Bingsheng He
National Univ. of Singapore


Back End Award: Session 8A.3:
SALT: Provably Good Routing Topology by a Novel Steiner Shallow-Light Tree Algorithm

Gengjie Chen, Peishan Tu, Evangeline F.Y. Young
Chinese Univ. of Hong Kong
Ten Year Retrospective Most Influential Paper Award 
Lightweight Secure PUFs, 2008

Mehrdad Majzoobi, Farinaz Koushanfar
Rice University
Miodrag Potkonjak
Univ. of California, Los Angeles
IEEE/ACM WILLIAM J. MCCALLA ICCAD BEST PAPER AWARD
This award is given in memory of William J. McCalla for his contributions to ICCAD and his CAD technical work throughout his career.
Front-End Award:Session 4A.1:
Malicious LUT: A Stealthy FPGA Trojan Injected and Triggered by the Design Flow


Christian Krieg, Clifford Wolf, Axel Jantsch
Technische Univ. Wien


Back End Award: Session 9A.1:
Fast Physics-Based Electromigration Checking for On-Die Power Grids


Farid N. Najm, Sandeep Chatterjee
University of Toronto
Valeriy Sukharev
Mentor Graphics Corp.

Ten Year Retrospective Most Influential Paper Award 
An Analytical Model for Negative Bias Temperature Instability, 2006

Sanjay V. Kumar, Chris H. Kim, Sachin S. Sapatnekar
Univ. of Minnesota
ICCAD 2006, pp. 493 – 496
IEEE/ACM WILLIAM J. MCCALLA ICCAD BEST PAPER AWARD
This award is given in memory of William J. McCalla for his contributions to ICCAD and his CAD technical work throughout his career.
Front-End Award:Session 5A.1:
A Polyhedral-based SystemC Modeling and Generation Framework for Effective Low-power Design Space Exploration

Wei Zuo, Warren Kemmerer, Jong Bin Lim
Univ. of Illinois at Urbana-Champaign
Louis-Noël Pouchet
Ohio State Univ.
Andrey Ayupov, Taemin Kim, Kyungtae Han
Intel Corp.
Deming Chen
Univ. of Illinois at Urbana-Champaign


Back End Award: Session 4B.2:
Defect Clustering-Aware Spare-TSV Allocation for 3D ICs


Shengcheng Wang, Mehdi Tahoori
Karlsruhe Institute of Technology
Krishnendu Chakrabarty
Duke Univ.

Ten Year Retrospective Most Influential Paper Award 
Performance Analysis of Carbon Nanotube Interconnects for VLSI Applications, 2005

Navin Srivastava, Kaustav Banerjee
Univ. of California, Santa Barbara
ICCAD 2005, pp. 383 – 390
IEEE/ACM WILLIAM J. MCCALLA ICCAD BEST PAPER AWARD
This award is given in memory of William J. McCalla for his contributions to ICCAD and his CAD technical work throughout his career.
Front-End Award:Session 4C.3:
Using Multi-Level Cell STT-RAM for Fast and Energy-Efficient Local Checkpointing


Ping Chi, Cong Xu, Yuan Xie
Pennsylvania State Univ.
Tao Zhang
NVIDIA Corp.
Xiangyu Dong
Google, Inc.


Back End Award: Session 4D.1:
Modeling and Analysis of Nonstationary Low-Frequency Noise in Circuit Simulators: Enabling Non Monte Carlo Techniques

Ahmet Gokcen Mahmutoglu, Alper Demir
Koc Univ.
Ten Year Retrospective Most Influential Paper Award 
A Thermal-Driven Floorplanning Algorithm for 3D ICs, 2004

Jason Cong, Jie Wei, and Yan Zhang
Univ. of California, Los Angeles
ICCAD 2004, pp. 306-313
IEEE/ACM WILLIAM J. MCCALLA ICCAD BEST PAPER AWARD
This award is given in memory of William J. McCalla for his contributions to ICCAD and his CAD technical work throughout his career.
Front-End Award:Session 2B.1:
Improved SAT-based ATPG: More Constraints, Better Compaction


Stephan Eggersglüß, Robert Wille,
Rolf Drechsler

Univ. of Bremen / DFKI


Back End Award: Session 5B.2:
Methodology for Standard Cell Compliance and Detailed Placement for Triple Patterning Lithography

Bei Yu, Xiaoqing Xu, Jhih-Rong Gao and David Z. Pan
Univ. of Texas at Austin


Ten Year Retrospective Most Influential Paper Award 
Statistical Timing Analysis Considering Spatial Correlations Using A Single PERT-Like Traversal

Hongliang Chang, Sachin S. Sapatnekar
Univ. of Minnesota
ICCAD 2003 Proceedings: pp. 621-625

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