2017 International Conference On Computer Aided Design

The Premier Conference Devoted to Technical Innovations in Electronic Design Automation

November 13-16, 2017Irvine Marriott Irvine, CA


Deadline for Abstract Submissions: Submissions for abstracts are now closed.

Deadline for Paper Submissions: Submissions for papers are now closed.

Download the 2017 Call For Papers PDF.

Original technical submissions on, but not limited to, the following topics are invited:


1.1 System Design

  • System-level specification, modeling, and simulation
  • System design flows and methods
  • HW/SW co-design, co-simulation, co-optimization, and co-exploration
  • HW/SW platforms for rapid prototyping
  • System design case studies and applications
  • System-level issues for 3D integration
  • Micro-architectural transformation
  • Memory architecture and system synthesis
  • System communication architecture
  • Network-on-chip design methodologies and CAD
  • Network-on-chip design case studies and prototyping

1.2 Hardware for Embedded Systems

  • Multi-core/multi-processors systems
  • HW/SW co-design for embedded systems
  • Static and dynamic reconfigurable architectures
  • Memory hierarchies and management
  • System-level consideration of custom storage architectures (flash, phase change memory, STT-RAM, etc.)
  • Application-specific instruction-set processors (ASIPs)
  • Hardware and devices for neuromorphic and neural network computing
  • Design method for learning on a chip
  • New hardware techniques for approximate/stochastic computing

1.3 Embedded System Software

  • Real-time software and operating systems
  • Middleware and virtual machines
  • Timing analysis and WCET
  • Programming models for multi-core systems
  • Profiling and compilation techniques
  • Design exploration, synthesis, validation, verification, and optimization
  • Embedded software development
  • Embedded runtime support and resource management

1.4 System-level Security

  • Hardware-based security (CAD for PUF’s, RNG, AES etc)
  • Detection and prevention of hardware Trojans
  • Side-channel attacks, fault attacks and countermeasures
  • Split manufacturing for security
  • System software security techniques
  • Design for security
  • CAD for security
  • Security implications of CAD
  • Cyberphysical system security
  • Nanoelectronic security
  • Counterfeiting
  • Supply chain security

1.5 Dark Silicon and Power/Thermal Considerations in System Design

  • Power and thermal estimation, analysis, optimization, and management techniques for hardware and software systems
  • Energy- and thermal-aware application mapping and scheduling
  • Energy- and thermal-aware dark silicon system design and optimization
  • Energy- and thermal-aware architectures, algorithms and techniques
  • Run-time management for the dark silicon

1.6 System Design Issues for Heterogeneous Computing

  • Hardware-software partitioning of workloads
  • Modeling and simulation of heterogeneous platforms
  • High-level synthesis for heterogeneous computing
  • Power/performance analysis of heterogeneous and cloud platforms
  • Programming environment of heterogeneous computing
  • Acceleration techniques including GPGPU and FPGA and dedicated ASIC’s
  • Application driven heterogeneous platforms for big data, machine learning etc.
  • Cloud Internet-of-Things (IoT) applications
  • Interaction of Internet-of-Things (IoT) devices and the cloud
  • Cloud computation for Internet-of-Things (IoT) devices
  • Systems for neural computing (including deep neural networks)
  • Applications and designs for systems based on optical devices


2.1 High-level, Behavioral, and Logic Synthesis and Optimization:

  • High-level/Behavioral/Logic synthesis
  • Technology-independent optimization and technology mapping
  • Functional and logic timing ECO
  • Resource scheduling, allocation, and synthesis
  • Interaction between logic synthesis and physical design

2.2 Testing, Validation, Simulation, and Verification

  • High-level/Behavioral/Logic modeling and validation
  • High-level/Behavioral/Logic simulation
  • Formal, semi-formal, and assertion-based verification
  • Equivalence and property checking
  • Emulation and hardware simulation/acceleration
  • Post-silicon functional validation
  • Digital fault modeling and simulation
  • Delay, current-based, low-power test
  • ATPG, BIST, DFT, and compression
  • Memory test and repair
  • Core, board, system, and 3D IC test
  • Post-silicon validation and debug
  • Analog, mixed-signal, and RF test

2.3 Cell-Library Design, Partitioning, Floorplanning, Placement

  • Cell-library design and optimization
  • Transistor, gate, and wiring sizing
  • High-level physical design and synthesis
  • Estimation and hierarchy management
  • 2D and 3D partitioning, floorplanning, and placement
  • Post-placement optimization
  • Buffer insertion and interconnect planning

2.4 Clock Network Synthesis, Routing, and Post-Layout Optimization and Verification

  • 2D and 3D clock network synthesis
  • 2D and 3D global and detailed routing
  • Package-/Board-level routing and chip-package-board co-design
  • Post-layout/-silicon optimization
  • Layout and routing issues for optical interconnects


3.1 Design for Manufacturability

  • Process technology characterization, extraction, and modeling
  • CAD for design/manufacturing interfaces
  • CAD for reticle enhancement and lithography-related design
  • Variability analysis and statistical design and optimization
  • Yield estimation and design for yield
  • Physical verification and design rule checking

3.2 Design for Reliability

  • Analysis and optimization for device-level reliability issues (stress, aging effects, ESD, etc.)
  • Analysis for interconnect reliability issues (electromigration, thermal, etc)
  • Reliability issues related to soft errors
  • Design for resilience and robustness
  • Reliability issues for optical devices

3.3 Timing, Power Networks, and Signal Integrity

  • Deterministic and statistical static timing analysis and optimization
  • Power and leakage analysis and optimization
  • Circuit and interconnect-level low power design issues
  • Power/ground network analysis and synthesis
  • Signal integrity analysis and optimization

3.4 CAD for RF/Analog and Multi-Domain Modeling and Interconnect

  • CAD for analog, mixed-signal, RF
  • CAD for mixed-domain (semiconductor, nanoelectronic, MEMS, and electro-optical) devices, circuits, and systems
  • CAD for nanophotonics and optical devices
  • Analog, mixed-signal, and RF noise modeling and simulation
  • Device, interconnect and circuit extraction and simulation
  • Package modeling and analysis
  • EM simulation and optimization
  • Behavior modeling of devices and interconnect
  • Modeling of complex dynamical systems (molecular dynamics, fluid dynamics, computational finance, etc.)


4.1 Biological Systems and Electronics

  • CAD for biological computing systems
  • CAD for systems and synthetic biology
  • CAD for bio-electronic devices, bio-sensors, MEMS, and systems

4.2 Nanoscale and Post-CMOS Systems

  • New device structures and process technologies
  • New memory technologies (flash, phase change memory, STT-RAM, memristor, etc.)
  • Nanotechnologies, nanowires, nanotubes, graphene, etc.
  • Quantum computing
  • Optical devices and communication
  • CAD for bio-inspired and neuromorphic systems

4.3 CAD for Cyber-Physical Systems

  • CAD for Internet-of-Things (IoT) and sensor networks
  • Design issues for Internet-of-Things (IoT) Devices
  • Modeling and analysis of CPS
  • CAD for automotive systems and power electronics
  • Dependable and safe CPS design
  • Analysis and optimization of data centers
  • CAD for display electronics
  • Green computing (smart grid, energy, solar panels, etc.)


Paper submissions must be made through the online submission system at the ICCAD website: https://www.softconf.com/g/iccad2017.

Regular papers will be reviewed as finished papers; preliminary submissions will be at a disadvantage.

Authors are asked to submit their work in two stages. In stage one (abstract submission), a title, abstract, and a list of all co-authors must be submitted via the ICCAD web submission site. In stage two (paper submission), the paper itself is submitted. Authors are responsible for ensuring that their paper submission meets all guidelines, and that the PDF is readable.

Deadline for Abstract Submissions: Submissions for abstracts are now closed.

Deadline for Paper Submissions: Submissions for papers are now closed.

We always have several authors contact the ICCAD office asking for a deadline extension. Due to the limited review cycle, NO extensions are granted for ANY reason.


  • All papers must be in PDF format only, with savable text.
  • Each paper must be no more than 8 pages (including the abstract, figures, tables, and references), double-columned, 9pt or 10pt font.
  • Your submission must not include information that serves to identify the authors of the manuscript, such as name(s) or affiliation(s) of the author(s), anywhere in the manuscript, abstract, or in the embedded PDF data. References and bibliographic citations to the author(s) own published works or affiliations should be made in the third person
  • Submissions not adhering to these rules, or determined to be previously published (this includes pre-prints publicly available on personal or other websites, such as arXiv, or publicly available internal memoranda with author names divulged) or simultaneously submitted to another conference, or journal, will be summarily rejected. Internal memoranda with full content not publicly available, and with author names not divulged, may be submitted.

IMPORTANT: Final camera-ready versions must be identical to the submitted papers with the following exceptions; inclusion of author names/affiliation, correction of identified errors, addressing reviewer-demanded changes. No other modifications of any kind are allowed including modification of title, change of the author list, reformatting, restyling, rephrasing, removing figures/results/text, etc. The TPC Chairs reserve the right to finally reject any manuscripts not adhering to these rules. A report detailing all the revisions made must be submitted together with the final camera-ready manuscript once any revision is conducted.


Paper templates are available below; authors are recommended to format their papers based on one of these templates: Suggested ACM Proceedings Paper Template


Authors will be notified of acceptance on or before Wednesday, June 28, 2017. Final paper guidelines will be sent at that time.


The deadline for final papers is Wednesday, August 2, 2017. Accepted papers are allowed six pages in the conference proceedings free of charge. Each additional page beyond six pages is subject to the page charge at $150.00 per page up to the eight-page limit. IEEE will hold the copyright for ICCAD 2017 proceedings. Authors of accepted papers must sign an IEEE copyright release form for their paper.


At least one author per accepted paper must register by Wednesday, August 2, 2017, at the discounted speaker’s registration rate. Failure to register will result in your paper being removed from the conference proceedings. IEEE reserves the right to exclude a paper from distribution after the conference (e.g., removal from IEEE Xplore) if the paper is not presented at the conference.


The awards are split into three categories. Two papers from this year's ICCAD conference, one from front-end and one from back-end, will be awarded with this prestigious award. The winners will be chosen from nominated papers after a thorough and competitive process by area-specific selection committees and announced at the opening session.

One paper from the 2006 and 2007 editions of ICCAD will be selected for the 10-year retrospective most influential paper award as evidenced by impact on the research community reflected in citations, on the vendor community via its use in an industrial setting, or by initiating new research venues during the past decade. Nominations from the community are welcome and can be sent to David Pan, Technical Program Vice Chair at dpan@ece.texas.edu.


All are due on Thursday, April 27, 2017. Click here for more information.